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Silicon Wafer Back Grinding Process by Wafer World Inc.
4.3 (49 items)
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$54.00 cheaper than the new price!!
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New $90.00
Product details
| Management number | 211141845 | Release Date | 2026/04/04 | List Price | $36.00 | Model Number | 211141845 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
The process of thinning or back grinding silicon wafers from the rear involves eliminating material to enhance efficiency and decrease costs in semiconductor manufacturing.
| Color | Gray |
|---|---|
| Brand Name | Wafer World Inc. |
| Manufacturer | Wafer World Inc. |
| Power Source | manual |
| Material Type | Silicon |
| Specific Uses For Product | Semiconductor manufacturing |
| Recommended Uses For Product | grinding spices and herbs, milling grains for flour, making nut butters and pastes |
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